High-Temp Silicone Potting Material Potting Compound for PCB/ Electronics

• CAS No.: 7085-85-0
• Formula: Mixture
• EINECS: 230-391-5
• Bonding Function: High Temperature Resistant Adhesive
• Morphology: Paste
• Application: Automobile, Electronical Components
• Model NO.: 9100
• Material: Silicone
• Classification: Room Curing
• Main Agent Composition: Silicone
• Characteristic: Waterproof
• Promoter Composition: Curing Agent
• Composition: Organic Material
• Color: Clear
• Package Available: 100g, 300ml, 5kg, 10kg
• Certificate: ISO/Ts16949, MSDS
• Shelf Life: 1 Year
• Free Sample: Yes, Buyer Need Pay Freight
• OEM Service: Yes
• Transport Package: Metal Drum or Carteidge
• Specification: 310ml/cartridge, 10kg/drum
• Trademark: Customized
• Origin: China
• HS Code: 3506100010
• Production Capacity: 100000kg/Month

Product Description

One component silicone potting compound for potting electronic components/PCB/LED/solar modules



Application:
It is one component RTV silicone potting adhesive. It's designed for potting LED, PCB, cable and solar modules etc. with high temperature resistance.
 
Product Features:
1. Middle viscosity, good flowability, high transparency and easy to operate.
2. Good weather resistant, anti-yellowing, water-proof.
3. Good flexibility, bending resistance.
4. Keep good performance in working temperature from -50ºC to 250ºC.
5. Non-toxic after curing, good adsorbability.

Technical Data Sheet:

Color	Transparent	Viscosity	10000±500
Specific gravity	1.0-1.04g/cm3	Hardness(Shore-A)	20-25
Tensile strength	≥0.8MPa	Shear strength	≥1.0MPa
Elongation at break	≥200%	Working temperature	-50ºC to 250ºC
Breakdown voltage	20Kv/mm	Volume resistivity	3×10^15Ω.cm
Dielectric constant	2.8(1MHz)	Curing time	24 hours/3mm at 25ºC

 
 
Packing:
310ml/cartridge, 5kg/metal drum, 10kg/metal drum or customize